Precision Drilling

Laser drilling for unmatched quality levels

Whenever  mechanical drilling methods reach their limits, laser drilling should  be used. Not only can lasers be used to drill holes extremely  accurately, they can also be used to achieve previously unattainable  levels of quality. In addition, laser drilling is particularly gentle.  Since it is a non-contact process, there are no thermal or mechanical  stresses on the material. There is no debris, because the removed  material only evaporates and is completely absorbed.

The economic benefits of laser drilling. 

However,  with the laser drilling process, drilling diameters that are not  possible with the cutting process can not only be realized, but can also  be used very economically. Laser drilling is not only faster to  produce, but also more reliable than conventional methods, and can be  easily and fully automated by the program.

 Advantages of laser drilling over traditional drilling methods 

 Cheap, accurate, fast. 

 Laser technology offers decisive advantages over conventional drilling methods: 

 Non-contact process - no mechanical tool wear, no force on the material. 

Large process windows combined with non-marring tools for maximum price stability at the highest quality.

 Minimal thermal load - no coolant, no component damage in the vicinity of the laser process. 

 Optional Diameter(Via):Minimum pore size is 15μm, even in hard to access areas. 

 Low maintenance costs. 

 Will not damage surfaces or substrates. 

 Precision drilling without post-processing. 

 Maximum cleanliness - no debris or dust. 

 Small hole-to-hole distances can be realized. 

 material freedom 

 Design Freedom 

 process stability 

 Ultra-short pulse laser for laser drilling 

1.  Today, ultrashort laser pulses are essential for a variety of materials  with high aspect ratios. Short pulses allow for minimal through-holes,  which means that smaller electronic devices can be realized;

2.  Since the early 2000s, the development of high-performance  ultrashort-pulse lasers as electronics have become smaller and smaller  has enabled new processing methods with pulses in the femtosecond and  picosecond ranges;

 3. Strong localization of energy input; 

4.  Semiconductors and insulators such as silicon. Glass . Sapphire and  ceramics, can effectively handle nonlinear absorption mechanisms;

 5. No enamel deposits; 

 6. Highest process quality due to direct evaporation and suction of material; 

 7. Low heat loss - high horizontal resolution down to the sub-micron range; 

 8. Lateral dissolution is independent of heat loss; 

 9. No shockwaves; 

 10. No microcracks; 

 11. No stratification; 

 12. There is no significant heat input. 

Most major suppliers of laser machines are now available: 

1.  The right machine can be supplied for each machining and manufacturing  process. Each material and each material thickness. A variety of laser  options and different system attributes enable you to find the right  balance between cost and quality for laser drilling applications.

2.Laser source: UV. Green and infrared lasers with nanosecond . Picosecond and femtosecond pulse durations.

3.  Degree of automation: stand-alone or as part of a fully integrated  production line (Industry 4.0 ready), all from a single source!

4. Pore size: microporous diameter >15μm. 

5. Aspect ratio (depth-to-diameter ratio): 1.5-2. 

6. Materials: metal, ceramic, copper and FR4. FR4. FR5. polyamide, etc. 

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